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You will be a part of the Automotive and Industrial Solutions Group which is a global leader in the design, manufacturing and marketing of microcontrollers (MCUs) and embedded processors in the automotive, consumer and industrial markets. These products include 8-, 16- and 32-bit MCUs, 16-bit digital signal controllers (DSCs) and 32-bit microprocessors, as well as wireless connectivity solutions.
Responsibilities:-
- Will be responsible for Hierarchical partitioning of Multi million gate Count SOC.
- Die Size estimation.
- Power estimation and Power Planning.
- Floor planning at chip and block level.
- Package Closure : Padring creation for Flip chip and Wire bond Packages.
- Probe Card design in closed collaboration with PE/TE/DFT Team.
- Thermal Analysis.
- Power EM / IR drop analysis (Static and Dynamic).
- ESD/EMC closure.
- Yield enhancement (DFM).
- Close interaction with worldwide team members apart from SOC team (IO/ESD/Systems/IP design teams/Package Team/validation).
- Physical Verification (LVS/DRC).
Qualifications:-
We are looking for a candidate with these specific personal characteristic and qualifications:-
- Master/Bachelor's Degree in Electrical/Electronic Engineering.
- At least 3 year(s) of working experience in Physical Integration.
- Must possess a strong knowledge of Physical design flow.
- Must have a firm understanding and hands-on experience on industry Power routing, Power EM/IR analysis, Physical verification.
- Should be a team player and willing to work with cross functional teams in issues resolution
- Creative problem-solving skills and the ability to logically break complex problems down to manageable components.
- Self-motivated.
- Good written and verbal communication skill.
Location:-
- Noida, India.
Company Overview:-
NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 29,000 employees in more than 30 countries and posted revenue of $8.61 billion in 2020.