DKEM DK92 Metallization Paste

DKEM DK92 Metallization Paste

Product Brief: DK Electronic Materials Inc. (DKEM) launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE

Product Feature: The DK92 series is claimed to demonstrate a superior process window and compatibility with different contact requirements and diversified passivation technologies and processes. Specifically for dual-side passivated ALD, a breakthrough of front-side silver paste has been achieved with improved Ohmic contact and about 2mV U c gain from low temperature firing.

Application: Metallization of PERC cells including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions

Benefits: DK92A front-side silver paste for ‘Black Silicon’ multicrystalline PERC cells provides more than 1 N/mm adhesion enhancement on Black Silicon textured wafers with superior low-temperature firing property (-20-30oC over industry PERC benchmark) and a contact window enlarged to >120 Ohm/ sq. The paste can achieve >20.20% efficiency for Black Silicon PERC multicrystalline cells. A special version has been developed for wrap-around deposited and dual-sided passivated AlOx for front-side PERC cells.

Availability: Available

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